Electronic

Five Fundamentals for Efficient Materials Sample Preparation’

Five Fundamentals for Efficient Materials Sample Preparation

Improve Throughput in Metallographic and Hardness Testing Labs Save time and money while creating efficient processes! Buehler knows the challenges of busy labs that are trying to meet production schedules; you may be fighting bottlenecks in the lab or just antiquated methods.  Whether you are preparing metallographic samples for microstructural analysis or hardness testing, sample …

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Printed Circuit Boards

Quality Control in Printed Circuit Boards

Printed Circuit Board Through Hole Inspection Quality control in Printed Circuit Boards is important to ensure the reliability of the final product.  Significant value is added to the boards through the manufacturing process, and so rapid assessment of the boards after each stage or immediately after final production is vital to ensure any problems are …

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Litium

Lithium Batteries to Power the Future, Buehler Sets Stage with Sample Preparation Insight

Lithium battery manufacturing will reach new heights in the coming years.  Manufacturers are gearing up for the explosion of the electrical vehicle market.    Lithium ion batteries have found wide application due to their high energy and power densities compared to conventional batteries. They find wide application in portable electronics, hybrid/full electric vehicles , power tools …

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Targeting Through Holes in Printed Wiring Boards (PWB) – Use of Reference Pins

Targeting Through Holes in Printed Wiring Boards (PWB) – Use of Reference Pins

When using the PC-MET and PWB-MET targeted grinding fixtures from Buehler, it’s necessary to set the total grinding distance from a reference pin on which the sample is mounted to the feature of interest.  In the standard equipment, this distance is set to 0.150” as shown in the diagram. The perfect target is reached by …

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IsoMet High Speed

Sectioning of Electronic Components

Introduction Sectioning of electronic components for quality control or failure analysis can be challenging as care must be taken to ensure the true structure is revealed, free from preparation-induced artifacts. Historically, sectioning processes that were highly damaging to the sample were used, which could induce artifacts that could easily be misinterpreted as manufacturing defects or …

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